Since 2008, Ring PCB has established itself as a leading provider of rigid PCB solutions in our Shenzhen factory. With years of expertise, Ring PCB is equipped to meet the diverse needs of clients across various industries, from consumer electronics to automotive industry and medical fields.

Understanding Rigid PCB

Rigid PCBs are non-flexible boards made from solid substrates like FR-4, metal materials that provide structural stability and a firm foundation for circuits. Unlike flexible PCBs, which can bend, rigid PCBs maintain a fixed shape, making them suitable for applications that require long-lasting durability.

Ring PCB’s Expertise in Rigid PCB Manufacturing

1. State-of-the-Art Manufacturing Facility

Ring PCB’s facility in Shenzhen, China is equipped with the latest machinery and technology, including Laser Direct Imaging (LDI), CNC drilling, automated optical inspection (AOI), and high-precision lamination equipment. This allows us to manufacture rigid PCBs with high accuracy, consistency, and minimal defects. Our facility is capable of handling complex multilayer rigid PCBs, up to 40 layers, to support high-density designs.

2. High-Quality Material Selection

Ring PCB sources materials from reliable renowned suppliers, offering a variety of options, including:

lFR-4: The most widely used material for rigid PCBs, providing excellent strength, durability, and thermal resistance.

lHigh-Temperature and High-Frequency Materials: For applications that require superior heat dissipation or operate at higher frequencies.

lAluminum and Copper Substrates: Ideal for power applications requiring enhanced heat management.

3. Comprehensive Design Support

At Ring PCB, we provide comprehensive design support to help clients optimize their rigid PCB designs for performance and manufacturability. Our engineers work closely with clients to ensure designs meet industry standards, adhere to design for manufacturability (DFM) principles, and provide reliable performance in their applications.

Design support includes:

lLayer Stack-Up Design: Our team assists in designing efficient layer stack-ups, optimizing impedance control, signal integrity, and power delivery.

lThermal Management: For applications with high power output, we advise on thermal management techniques, including the addition of thermal vias, heatsinks, and proper material selection.

lDFM Analysis: Ring PCB provides DFM analysis to identify and address potential manufacturing issues before production, ensuring a smooth manufacturing process.

4. Advanced Quality Assurance and Testing

We utilize a multi-stage testing approach to guarantee that each PCB meets or exceeds quality standards. Our quality control processes include:

lAutomated Optical Inspection (AOI): Detects surface defects, misalignments, and other issues with high precision.

lX-Ray Inspection: Used to examine internal layers, vias, and component placements for multilayer boards.

lElectrical Testing: Validates the functionality of the PCB, checking for continuity, open circuits, and short circuits.

lThermal and Environmental Testing: Ensures that rigid PCBs can withstand real-world conditions, including thermal cycling and humidity exposure.

Types of Rigid PCBs We Manufacture

FR-4 Rigid PCBs

Metal-Core Rigid PCBs (MCPCBs)

Ceramic-Based Rigid PCBs

Rigid PCBs Manufacturing Capabilities of Ring PCB