Ring PCB Technology Co.,Limited
Flex PCB

Since 2008, Ring PCB has established itself as a trusted leader in flex PCB manufacturing at Shenzhen facility, combining extensive experience with state-of-the-art production capabilities.


What Is A Flex PCB?




















 

A Flex PCB, or Flexible Printed Circuit Board, is a type of circuit board designed to be flexible and bendable, as opposed to traditional rigid PCBs. It is typically constructed using a thin, flexible insulating substrate, like polyimide, which supports conductive copper circuits. Flex PCBs allow for intricate 3D designs, enabling electronic circuits to conform to unique shapes, fit into compact spaces, or endure continuous movement.


Advantages of Flex PCBs


- Space Optimization: Their ability to bend and conform to the shape of electronic components allows for efficient use of space.


- Lightweight Design: They are lighter than traditional rigid PCBs, making them ideal for applications requiring weight reduction.


- Durability and Longevity: Flex PCBs are resistant to vibrations and can withstand environmental stress, extending the product's lifespan.


- Enhanced Design Freedom: With the ability to fold or twist, flex PCBs give designers creative flexibility to meet complex product requirements.


The advantages makes them ideal for applications that require bending, twisting, or folding, such as in wearable devices, medical instruments, automotive dashboards, and aerospace systems. 


Ring PCB’s Flex PCB Manufacturing Capabilities


Capability

Description

Layer Count

Uo to 8 layers

Material Options

Polyimide, Polyester (PET), Adhesive-less materials

Thickness Range

0.05mm - 0.4mm (flexible material only)

Max Board Size

Up to 18" x 24"

Min Trace Width/Spacing

0.075mm (3 mil)

Min Hole Size

0.1mm (4 mil)

Surface Finish

ENIG, OSP, Immersion Silver, Immersion Tin, HASL

Stiffener Options

Polyimide, FR4, Stainless Steel

Impedance Control

±10% for high-frequency applications

Bend Radius

Down to 1.5x the material thickness

Solder Mask Colors

Yellow, White, Black, Green

Testing and Inspection

AOI, Electrical Testing, Thermal Cycling

Turnaround Time

Standard and expedited options available

Environmental Compliance

RoHS, REACH compliant materials

Certifications IATF

16949:2024

ISO 9001:2015

ISO14001:2015

ISO13485:2016


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flex pcb manufacturer

Ring PCB - Your Flex PCB Partner 


Ring PCBs facility in Shenzhen is equipped with advanced machinery and specialized production techniques that ensure precision in every flex PCB manufactured. Our offerings include:

 

- Single-Sided, Double-Sided, and Multi-Layer Flex PCBs: We can manufacture flex PCBs from one to multiple layers, ensuring that our solutions match the complexity and functionality required by our customers.

 

- Rigid-Flex PCB Manufacturing: By integrating flexible circuits with rigid boards, Ring PCB produces hybrid PCBs that offer the benefits of both rigidity and flexibility.

 

- Advanced Materials: Our production process supports a wide range of materials, including polyimide and flexible adhesives.

Inspection of Flex PCBs at Ring PCB


The inspection of flex PCBs differs significantly from that of rigid PCBs due to the unique physical properties and structural demands of flexible circuits. 


Mechanical Flexibility Testing


Flex PCBs undergo bend testing and flexibility analysis to ensure they can withstand repeated bending and movement without causing cracks or breaks in the conductive paths. This test is essential for applications where the PCB will be subject to mechanical stress.


Dimensional Stability and Warpage Control


Due to the flexibility, flex PCBs are more prone to warping and dimensional changes during the manufacturing process, especially during lamination and etching. Specialized inspection equipment, such as automated optical inspection (AOI) with tensioning setups, is often used to check for dimensional accuracy without deforming the PCB.


Surface and Layer Adhesion Inspection


Flex PCBs require careful inspection of layer adhesion because the flexible layers must remain bonded through movement. Peel tests and shear testing are often conducted to ensure that the copper traces adhere strongly to the polyimide substrate, avoiding delamination under stress.


Thermal Stress and Reliability Testing


Since Flex PCBs are often used in high-heat environments, thermal cycling tests are performed to check their durability under temperature variations. This helps ensure that the flexible materials maintain performance without cracking or degrading.


Visual and Automated Optical Inspection (AOI)


Flex PCBs often need specially adapted AOI systems that can hold the board flat without causing stress, allowing accurate inspection of fine features, especially with thinner substrates. Inspecting for fine defects like micro-cracks or alignment issues requires handling the flex board carefully to avoid introducing stress.


Electrical Continuity and Signal Integrity Testing


For Flex PCBs, testing for signal integrity and continuity can be complex due to potential impedance variations caused by bending. Testing may include dynamic bending tests to evaluate performance while flexed.