Ring PCB’s Advanced Testing and Inspection Capabilities  

1. Automated Optical Inspection (AOI)  

AOI systems play a critical role in ensuring PCB assembly quality. They use high-resolution cameras and advanced algorithms to inspect the surface of PCBs. Our AOI systems are integrated into every production line to perform real-time inspections, ensuring immediate identification and correction of errors.  

What It Detects:  

  - Misaligned or missing components.  

  - Soldering defects, such as bridges or insufficient solder.  

  - Surface defects like scratches or excess solder paste.  

2. X-Ray Inspection (AXI)  

Advanced X-ray inspection systems are essential for detecting issues in complex assemblies, especially in hidden solder joints like BGAs (Ball Grid Arrays) and microvias. We use AXI for high-density and critical applications, ensuring the structural integrity of every product.

What It Detects:  

  - Voids in solder joints.  

  - Internal layer alignment issues in multi-layer PCBs.  

  - Cracks or delamination in PCB substrates.    

3. In-Circuit Testing (ICT)  

In-Circuit Testing is a comprehensive method used to test the electrical performance of assembled PCBAs. Our ICT systems verify the functionality of each circuit, ensuring that all components are correctly installed and operational.  

What It Tests:  

  - Circuit continuity and resistance.  

  - Voltage levels and current flow.  

  - Component functionality (e.g., capacitors, resistors).

4.Flying Probe Testing

No need for custom fixtures, with the movable probes, controlled by precision motors, touch test points or pads on the PCB to measure continuity and isolation. We use it to test the electrical integrity of low-volume or prototype PCBs.

5. Thermal Cycling and Environmental Testing  

Reliability under extreme conditions is vital for products used in automotive, aerospace, and industrial applications. Our thermal cycling chambers subject PCBAs to rigorous environmental stress tests, ensuring durability and long-term performance.  

What It Simulates:  

  - High and low-temperature extremes.  

  - Rapid temperature changes.  

  - Humidity and moisture exposure.  

6. Solder Paste Inspection (SPI)

Solder paste deposition is a critical step in PCB assembly, and errors at this stage can lead to significant defects. Our SPI systems ensure precise solder paste application, reducing defects and improving assembly quality.  

What It Detects:  

  - Insufficient or excessive solder paste.  

  - Misaligned paste application.  

  - Defects in stencil printing.   

Quality Control Processes at Ring PCB  

1. Incoming Material Inspection  

Every batch of raw materials and components undergoes strict inspection to ensure they meet our high standards.  

2. Process Monitoring  

Real-time monitoring of production lines ensures consistency and early detection of potential issues.  

3. Final Quality Check  

Before shipping, every product is subjected to a comprehensive final inspection to verify performance and compliance.  

Meeting Industry Standards 

Shenzhen Factory Ensures Top-Quality PCBs

Ring PCB proudly operates our own factory in Shenzhen, allowing us to maintain complete control over the quality of every PCB we produce. With advanced equipment and stringent quality standards, we deliver reliable solutions tailored to your needs. You're welcome to visit our factory and see our commitment to excellence firsthand!

IPC Standards