Multilayer PCB Manufacturing
The manufacture of high-layer, high-difficulty, special materials, special process circuit boards, which has always been our characteristics; the continuous improvement of high-multi-layer circuit board manufacturing process as our goal. Every year we invest a lot of human resources and material resources in production equipment and process research and development and try our best to catch up with the development of cutting-edge circuit board manufacturing technology.
Multilayer Printed Circuit Board
We can produce up to 40 layers of high-layer circuit boards, various buried and blind vias circuit boards, and HID PCB. HDI PCB can be up to 2 steps.
①: Min hole we can drill is 0.15mm, and 0.075mm for HDI design, and high-density print circuit board. ②: We can control impedance both single-end and differential for multi-layer(the min trace width/space is 4mil/4mil) ③: High precision circuit board( min trace width we can do 3mil, and the thinnest core we can do is 0.05mm) ④: Other special material board
Heavy copper board( copper weight:210-700um), copper base material, aluminum, PI material, BT material, high-frequency material, Rogers Series, PTFE material, Taconic Series, Arlon.
①: Flex-rigid board, high to six layer flex in the inner layer, gold finger in flex area. ②: Steps boards: can expose the pad and circuit for inner circuit ③: Mixture surface treatment: OSP+ENIG ④: Multi-layer metal board: double side copper baseboard, double side aluminum board. ⑤: Mixture laminating: can process two or more material mixture laminating, like Ceramic +FR4+PTFE ⑥: Multi-frequency board: every board use high-frequency material ⑦: Plugging resin